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Ryan Dunwoody - Pi-Top

“With Allegro TimingVision, the routing process has sped up dramatically, from four weeks, down to four days,”

Bill Munroe - Cavium

Designed with Cadence.
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“We’re very optimistic about our future with the scalable OrCAD PSpice and Allegro PCB Designer tools"

The Cadence solution reduces our PCB development time by 80 percent

- Gisbert Thomke, Group Leader, IBM R&D Lab

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Cadence PCB Mini Option

Available to rent for periods of 1 month


Cadence PCB Mini Option


Designers of high-end consumer electronics face the challenge of miniaturization and its resulting complexity. The number of nets on a printed circuit board (PCB) that have high-speed constraints is growing. As the industry migrates to multi-gigabit serial interfaces like PCI Express, the number of constraints on nets is also increasing. And as consumers demand ever-smaller gadgets packed with amazing features, complex die stacking is paramount to an IC packaging strategy.


Today’s PCB and package designers need a complete high-density interconnect (HDI) solution that includes high-speed rules, manages faster data throughput, and offers advanced routing capabilities to shrink footprints and meet aggressive market windows. 


PCB Mini Option Tutorial Videos

VIDEOConstraint Manager: HDI rule set
VIDEOMicro-via and associated spacing, stacking and via-in-pad rules
VIDEOConstraint driven HDI design flow
VIDEOHDI micro-via stack editing
VIDEOManufacturing rule support for embedding components  
VIDEOEmbed components on inner layers
VIDEOSupport for Cavities on inner layers  
VIDEOSupport for Vertically placed components on inner layers
VIDEODual Side Contact Embedded Components

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